Industry Applications

INDUSTRY APPLICATIONS

Custom Hot Melt Adhesive

For example, hot melt adhesives for bonding electronic components must offer low odor, high-temperature resistance, and electrical insulation. In contrast, those used in packaging require fast coating speeds and instant setting. Different customer equipment—such as coaters, dispensers, or spray systems—varies in operating temperature, coating speed, and application method, requiring specific adhesive properties like melt viscosity, open time, and tailing behavior. High-speed lines need adhesives that bond quickly, while manual operations benefit from longer open times to allow precise positioning.

With years of deep expertise in the hot melt adhesive industry, Tongde boasts a professional R&D team and a comprehensive customized service system. We have delivered tailored solutions to over 1,000 clients across electronics, packaging, automotive, furniture, healthcare, and more.

Customized solutions

Customization Process

CUSTOMIZATION PROCESS

Robust technical expertise

We offer mature technical solutions tailored to bonding challenges across diverse substrates and specialized equipment requirements. Our approach delivers rapid response to personalized needs, resolving issues such as weak adhesion, slow curing, and poor equipment compatibility.

Continuous technical iteration

We stay ahead of industry technology trends by continuously optimizing our formula systems, ensuring our customized products lead the market in environmental friendliness, efficiency, and stability. Whether your production involves any substrate or process equipment, Tongde leverages its deep R&D expertise to deliver tailored hot melt adhesive solutions that boost your production efficiency and enhance product quality.

Understand Requirements

Prototype Development

Sample Test

Pilot Production

Sample test

Sign Contract

Continuously optimize

Product Customization

Please share your customization requirements. We'll review them and promptly respond with a tailored plan.